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Boilpeak Seals Technology

Boilpeak Seals Technology

Private
Huai'anFrontier & Industrial Techhttps://boilpeak.com/

Last Round

Series A

Extension

Jan 18, 2026

Momentum

Top 25%

of companies Caplight tracks

Company Overview

Boilpeak Seals Technology is a manufacturing company that develops, produces, and sells high-performance sealing components for the semiconductor, photovoltaic, and display panel industries.

Sector

Frontier & Industrial Tech

Verticals

Advanced Materials, Semiconductors, Aviation & Drones, Renewable Energy, Biotech Equipment

Business Model

B2B

Customer Profile

Hardware Sales, Services & Consulting

AI Layer

Non-AI

Keywords

O-ringsindustrial sealssealing solutionsrubber gasketscustom molded rubberFFKM O-ringssemiconductor sealsOEM manufacturingencapsulated O-ringsX-ringshydraulic sealspneumatic sealsaerospace sealscleanroom production

Historical Pricing

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Caplight Momentum Score

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Boilpeak Seals Technology Comparables

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Boilpeak Seals Technology comparables — related companies by embedding similarity
CompanySimilarityMarket Cap
Parker Hannifin Corporation
72%
Trelleborg AB
71%
AB SKF
69%

Boilpeak Seals Technology Funding Rounds

Historical fundraising activity

Data table
RoundDateAmount RaisedValuationInvestorsSources
Series A ExtensionJan 18, 2026
Series AOct 29, 2025

Boilpeak Seals Technology Investors

Notable investors and investment history

Boilpeak Seals Technology investors
InvestorRounds
Shenzhen Capital GroupSeries A, Series A Extension
Triniti CapitalSeries A Extension
Shenzhen Capital GroupSeries A

Market signals

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  • Jan 18, 2026

    Funded by Shenzhen Capital Group and Triniti Capital.

  • Oct 29, 2025

    Led by Shenzhen Asset Yuanzhi Huaxin Emerging Industry Fund.

Boilpeak Seals Technology Filings

SEC and related filings with document metadata.

Data table
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Boilpeak Seals Technology Filings

SEC and related filings with document metadata.

Frequently Asked Questions

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Firmographic Details

HeadquartersHuai'an
Employee Range2
Year Founded2018
Last FundingJan 18, 2026

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