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Suzhou Bopai Semiconductor Technology Co., Ltd.

Suzhou Bopai Semiconductor Technology Co., Ltd.

Private
SuzhouFrontier & Industrial Techhttp://www.bopaisemi.com/

Last Round

Series A

Mar 18, 2024

Total Funding Raised

$27.97M

Company Overview

Suzhou Bopai Semiconductor Technology Co., Ltd. is a semiconductor technology company that develops and manufactures advanced semiconductor packaging solutions, equipment, and materials.

Sector

Frontier & Industrial Tech

Verticals

Semiconductors, Advanced Materials, Smart Manufacturing, Sensors

Business Model

B2B

Customer Profile

Hardware Sales, Services & Consulting, Data as a Service

AI Layer

Non-AI

Keywords

advanced semiconductor packagingsemiconductor packaging equipmentOSATAMB ceramic substratespower semiconductor packagingsintering systemstransfer molding systemsdie bondersMEMS packagingchip packagingSiC power semiconductorssemiconductor assemblyback-end semiconductorsemiconductor supply chain

Historical Pricing

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Suzhou Bopai Semiconductor Technology Co., Ltd. Comparables

Compare Suzhou Bopai Semiconductor Technology Co., Ltd. with similar companies based on industry and business-model similarity.

Suzhou Bopai Semiconductor Technology Co., Ltd. comparables — related companies by embedding similarity
CompanySimilarityMarket Cap
珠海市硅酷科技有限公司
82%
AMX Automatrix
78%
Zhongke Guangzhi (Chongqing) Technology Co., Ltd.
78%

Suzhou Bopai Semiconductor Technology Co., Ltd. Funding Rounds

Historical fundraising activity

Data table
RoundDateAmount RaisedValuationInvestorsSources
Series AMar 18, 2024
SeedAug 24, 2022
AngelDec 1, 2021

Suzhou Bopai Semiconductor Technology Co., Ltd. Investors

Notable investors and investment history

Suzhou Bopai Semiconductor Technology Co., Ltd. investors
InvestorRounds
Tianjin Venture Capital Management Co., Ltd.Series A
Suzhou Anjie Capital Investment Co., Ltd.Seed
Yongxin FangzhouSeries A
HongShan Capital Group (HSG)Angel

Market signals

Structured signals derived from secondary market and firmographic data.

  • Mar 18, 2024

    $28M round led by Tianjin Venture Capital Management Co., Ltd.

  • Aug 24, 2022

    Seed round with participation from Suzhou Anjie Capital Investment Co., Ltd.

Suzhou Bopai Semiconductor Technology Co., Ltd. Filings

SEC and related filings with document metadata.

Data table
TypedDateAmount OfferedAmount SoldFillingPagesDownload
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Suzhou Bopai Semiconductor Technology Co., Ltd. Filings

SEC and related filings with document metadata.

Frequently Asked Questions

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Firmographic Details

HeadquartersSuzhou
Year Founded2014
Last FundingMar 18, 2024

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