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FusionAP

Private
MalaysiaFrontier & Industrial Tech

Last Round

Pre Seed

May 13, 2026

Total Funding Raised

$2M

Momentum

Top 5%

of companies Caplight tracks

Company Overview

FusionAP is a semiconductor company that provides an outsourced semiconductor assembly and test (OSAT) platform for advanced 2.5D, 3D, and beyond packaging solutions.

Sector

Frontier & Industrial Tech

Verticals

Semiconductors, AI Training Infrastructure, Computing Hardware, Supply Chain

Business Model

B2B

Customer Profile

Services & Consulting, Government Contracts

AI Layer

Non-AI

Keywords

outsourced semiconductor assembly and testOSATadvanced packaging2.5D packaging3D packagingchip packagingsupply chain diversificationsemiconductor manufacturingchipletssemiconductor supply chainChina plus oneAI chipshigh-performance computingfabless semiconductor companiesMalaysia semiconductor

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Caplight Momentum Score

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FusionAP Comparables

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FusionAP comparables — related companies by embedding similarity
CompanySimilarityMarket Cap
Silicon Connect Sdn. Bhd.
83%
ASE Technology Holding Co., Ltd.
74%
Amkor Technology
73%

FusionAP Funding Rounds

Historical fundraising activity

Data table
RoundDateAmount RaisedValuationInvestorsSources
Pre SeedMay 13, 2026

FusionAP Investors

Notable investors and investment history

FusionAP investors
InvestorRounds
Southern Capital GroupPre Seed
Vertex Ventures Southeast Asia & IndiaPre Seed

Market signals

Structured signals derived from secondary market and firmographic data.

  • May 13, 2026

    $2M round led by Southern Capital Group and Vertex Ventures.

FusionAP Filings

SEC and related filings with document metadata.

Data table
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FusionAP Filings

SEC and related filings with document metadata.

Frequently Asked Questions

Common questions about FusionAP's valuation, stock price, and market status.

Firmographic Details

HeadquartersMalaysia
Year Founded2025
Last FundingMay 13, 2026

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