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Lendela

Lendela

Private

Last Round

Series A

Nov 23, 2023

Total Funding Raised

$6M

Company Overview

Lendela is a fintech company that operates a digital loan matching platform connecting borrowers with personalised loan offers from multiple banks and financial institutions.

Sector

FinTech

Verticals

Lending & Credit, Personal Finance

Business Model

B2B2C

Customer Profile

Marketplace Commission

AI Layer

Non-AI

Keywords

loan marketplaceloan aggregatorpersonal loandebt consolidationloan comparisonfintech marketplaceloan matchinglending platformloan brokerlead generationconsumer financeloan comparison sitecredit marketplacedigital lending

Historical Pricing

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Caplight Momentum Score

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Lendela Comparables

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Lendela comparables — related companies by embedding similarity
CompanySimilarityMarket Cap
FindTheLoan
83%
Jirnexu
80%
Catapult Ventures Pte Ltd
80%

Lendela Funding Rounds

Historical fundraising activity

Data table
RoundDateAmount RaisedValuationInvestorsSources
Series ANov 23, 2023
VC RoundJan 27, 2021
SeedSep 12, 2018

Lendela Investors

Notable investors and investment history

Lendela investors
InvestorRounds
Genting VenturesSeries A
2be.luVC Round
Cocoon CapitalVC Round, Series A, Seed
IMO VenturesSeed
Phillip Private EquitySeries A

Market signals

Structured signals derived from secondary market and firmographic data.

  • Nov 23, 2023

    $5M round with Genting Ventures, Phillip Private Equity, and Cocoon Capital.

  • Jan 27, 2021

    $2M round led by 2be.lu

Lendela Filings

SEC and related filings with document metadata.

Data table
TypedDateAmount OfferedAmount SoldFillingPagesDownload
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Lendela Filings

SEC and related filings with document metadata.

Frequently Asked Questions

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Firmographic Details

HeadquartersSingapore
Employee Range47
Year Founded2018
Last FundingNov 23, 2023

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