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SeekWave Technology

SeekWave Technology

Private
ShanghaiTelecommunications & Networkinghttps://seekwavetech.com/

Last Round

Series B

Jun 27, 2025

Est. Valuation

$223.75M

Total Funding Raised

$30.31M

Company Overview

SeekWave Technology is a semiconductor company that develops high-performance, low-power Wi-Fi and Bluetooth SoC chip solutions for consumer electronics and IoT applications.

Sector

Telecommunications & Networking

Verticals

Semiconductors, Consumer Electronics, IoT Hardware

Business Model

B2B

Customer Profile

Hardware Sales

AI Layer

Non-AI

Keywords

fabless semiconductorSoCsystem on a chipwireless connectivityWi-Fi chipBluetooth chipIoT hardwarechip designsemiconductor supplierB2B electronicslow-power chipscombo SoCchipsethardware componentsBOM reduction

Historical Pricing

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SeekWave Technology Comparables

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SeekWave Technology comparables — related companies by embedding similarity
CompanySimilarityMarket Cap
AIC Semiconductor (Shanghai) Co., Ltd.
93%
Bouffalo Lab (Nanjing) Co., Ltd.
89%
Senscomm Semiconductor
87%

SeekWave Technology Funding Rounds

Historical fundraising activity

Data table
RoundDateAmount RaisedValuationInvestorsSources
Series BJun 27, 2025
Series A ExtensionMay 22, 2024
Series A ExtensionSep 18, 2023
Series AJun 1, 2022
Pre SeedNov 1, 2021

SeekWave Technology Investors

Notable investors and investment history

SeekWave Technology investors
InvestorRounds
Northern Light Venture CapitalSeries A
Legend CapitalSeries B
Shunwei CapitalSeries A
Legend HoldingsSeries A
Guolian Tongbao Capital InvestmentSeries A Extension
华业天成资本Series A, Series A Extension

Market signals

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  • Jun 27, 2025

    $15.4M round led by Shanghai Fullhan Microelectronics Co Ltd.

  • May 22, 2024

    $15M round completed.

SeekWave Technology Filings

SEC and related filings with document metadata.

Data table
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SeekWave Technology Filings

SEC and related filings with document metadata.

Frequently Asked Questions

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Firmographic Details

HeadquartersShanghai
Year Founded2020
Last FundingJun 27, 2025

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