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UPBOND Co., Ltd.

UPBOND Co., Ltd.

Private
Tokyo, TokyoCrypto & Web3https://www.upbond.io

Last Round

Strategic

Mar 26, 2025

Est. Valuation

$18.72M

Total Funding Raised

$2.29M

Company Overview

UPBOND Co., Ltd. is a Japanese technology company founded in 2019 that develops and provides a customer relationship management (CRM) platform. The company's mission is to connect society through the power of individuals by creating a personal sovereign lifelogging platform. UPBOND offers services like "Login3.0," a next-generation customer ID infrastructure, and the "UPBOND Wallet" to facilitate the use of lifelogs. The company aims to provide individuals with full control over their personal data, including identity, behavioral, and health information, disrupting platforms that have traditionally monopolized such data. It operates on a SaaS model and is positioned within the Web3 domain.

Sector

Crypto & Web3

Verticals

Digital Identity, Blockchain Infrastructure, Digital Wallets

Business Model

B2B2C

Customer Profile

Usage-Based SaaS, Services & Consulting, Subscription SaaS

AI Layer

Application

Keywords

Web3 infrastructuredigital walletWeb3 walletNFT platformNFT issuanceblockchain integrationcrypto walletcustomer loyaltyWeb3 consultingWeb3 marketingCRM integrationenterprise blockchainSaaSAI agentlifelogging

Historical Pricing

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UPBOND Co., Ltd. Comps

Public and private peers based on sector, stage, and business model.

UPBOND Co., Ltd. comps — public and private peers by sector, stage, and business model
CompanyStatusEst. ValuationRev Multiple
OpenAIPrivate$86.0B~40x
CoherePrivate$5.0B--
Competitor 1Public$XX.XBXXx
Competitor 2Public$XX.XBXXx

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UPBOND Co., Ltd. Funding Rounds

Historical fundraising activity

Data table
RoundDateAmount RaisedValuationInvestorsSources
StrategicMar 26, 2025
Corporate FundingApr 5, 2024
Early FundingDec 22, 2022
GrantJul 21, 2022
Pre SeedOct 26, 2021
Pre Seed
Jun 10, 2021

Key People

Founding team and executive leadership

Miho Sakurada

CEO Office

Executive Team

Yuri Ardila

Chief Technology Officer

Executive Team

中島恒太

副社長 CSO兼CFO

Executive Team

Ken Honda

COO

Executive Team

UPBOND Co., Ltd. Investors

Notable investors and investment history

UPBOND Co., Ltd. investors
InvestorRounds
Scala Partners Inc.Early Funding
Realize Venture CapitalPre Seed
Soul CapitalSeed
Soul CapitalSeed
ValueCommerce Co., Ltd.Corporate Funding
REALIZE GROUPPre Seed
Minami Aoyama Advisory GroupPre Seed

UPBOND Co., Ltd. Filings

SEC and related filings with document metadata.

Data table
TypedDateAmount OfferedAmount SoldFillingPagesDownload
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UPBOND Co., Ltd. Filings

SEC and related filings with document metadata.

Frequently Asked Questions

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Firmographic Details

HeadquartersTokyo, Tokyo
Employee Range21
Year Founded2019
Last FundingMar 26, 2025

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