xi'an eswin material technology co., ltd.

Private

Last Round

IPO

Nov 29, 2024

Last Round Size

$573.6M

Total Funding Raised

$1.04B

Company Overview

Manufacturer of 12-inch silicon wafers for the semiconductor industry.

Sector

Electronics

Historical view of private secondary pricing and transaction trends.

Proprietary index based on bid/ask volume and sentiment.

Track how buyer interest and sentiment changes over time.

Compare xi'an eswin material technology co., ltd. with similar companies based on industry and business-model similarity.

Access detailed peer comparisons, similarity scores, and market data.

Historical fundraising activity

SEC and related filings with document metadata.

Data table
Typed	Date	Amount Offered	Amount Sold	Filling	Pages	Download
Mock Valuation	Sign Up to view	Mock Valuation	Sign Up to view	Mock Valuation	Sign Up to view	Mock Valuation
Mock Valuation	Sign Up to view	Mock Valuation	Sign Up to view	Mock Valuation	Sign Up to view	Mock Valuation
Mock Valuation	Sign Up to view	Mock Valuation	Sign Up to view	Mock Valuation	Sign Up to view	Mock Valuation
Mock Valuation	Sign Up to view	Mock Valuation	Sign Up to view	Mock Valuation	Sign Up to view	Mock Valuation

SEC and related filings with document metadata.

Common questions about xi'an eswin material technology co., ltd.'s valuation, stock price, and market status.

Headquarters—

Year Founded2016

Last FundingNov 29, 2024

Join leading institutional investors using Caplight to access private market data, discover pricing, and execute secondary block trades.

Requires verified institutional or accredited status.