xi'an eswin material technology co., ltd.

Private

Last Round

IPO Announced

Nov 29, 2024

Last Round Size

$573.6M

Total Funding Raised

$1.04B

Company Overview

Manufacturer of 12-inch silicon wafers for the semiconductor industry.

Sector

Electronics

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Headquarters—

Year Founded2016

Last FundingNov 29, 2024

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