xi'an eswin material technology co., ltd.

Private

—Electronicshttps://eswinmaterial.com

Last Round

IPO

11/29/2024

Last Round Size

$674M

Est. Valuation

$4B

Total Funding Raised

$1B

Company Overview

Manufacturer of 12-inch silicon wafers for the semiconductor industry.

Sector

Electronics

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xi'an eswin material technology co., ltd. Comps

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xi'an eswin material technology co., ltd. Funding Rounds

Historical fundraising activity

Round	Date	Amount Raised	Valuation	Investors	Sources
IPO	11/29/2024
Series C	12/9/2022
Series B	7/30/2021
Series A	1/31/2019

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xi'an eswin material technology co., ltd. Filings

SEC and related filings with document metadata.

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xi'an eswin material technology co., ltd. Filings

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Firmographic Details

Headquarters—

Year Founded2016

Last Funding11/29/2024

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